AMD’s Ryzen 7000 ‘Raphael’ series has already begun establishing ground with its tech-savvy users. People are excited to play around with the CPUs and unlock what the Zen 4-based devices can do.
An anonymous user published a delidded Ryzen 7000 image which revealed quite a bit about the firmware.
The image only shows the IHS itself; it’s relatively easy to dismantle and appears slightly thicker than past models due to the two CCDs and the IOD components.
The IHS is a challenging aspect of delidding. It seems to be glued to the CPU packaging in about seven spots and has been coated with some materials for a good solder interface, as seen on previous delidded, soldered CPUs.
The delidding appears to be destructive given the CCD and IOD attachment area. Whether the CPU still works after this experiment remains unconfirmed.
The Ryzen 7000 CPUs will consist of a new two-chiplet design, both carrying about eight Zen 4 cores. The new I/O 6 nm die will feature integrated RDNA2 graphics.
Here’s an overview of the Raphael series specs:
| Core Architecture | Zen 4(5 nm) |
| AMD Ryzen Series | Ryzen 7000 |
| Graphics | RDNA2 |
| Core Count | 16 |
| Socket Interface | AM5 |
| Memory | DDR5 |
| PTT | 230W |
| TDP | 170W |
| PCIe Gen | PCIe Gen 5.0 |
| Chipset | AMD 600 |
| Launch | Fall 2022 |
AMD will be launching the Raphael desktop series by this fall.
About Advanced Micro Devices
Advanced Micro Devices (AMD) is an American multinational semiconductor company headquartered in Santa Clara, California.
AMD develops computer processors and related technologies for business and consumer markets. AMD’s main products include microprocessors, motherboard chipsets, embedded processors and graphics processors for servers, workstations, personal computers and embedded system applications.
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